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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC3225TB 5 V, SILICON GERMANIUM MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC3225TB is a silicon germanium (SiGe) monolithic integrated circuits designed as IF amplifier for DBS tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Wideband response * Low current * Medium output power * High linearity * Power gain * Noise Figure * Supply voltage * Port impedance : fu = 2.8 GHz TYP. @ 3 dB bandwidth : ICC = 24.5 mA TYP. : PO (sat) = +15.5 dBm TYP. @ f = 0.95GHz : PO (sat) = +12.5 dBm TYP. @ f = 2.15 GHz : PO (1dB) = +9.0 dBm TYP. @ f = 0.95 GHz : PO (1dB) = +7.0 dBm TYP. @ f = 2.15 GHz : GP = 32.5 dB TYP. @ f = 0.95 GHz : GP = 33.5 dB TYP. @ f = 2.15 GHz : NF = 3.7 dB TYP. @ f = 0.95 GHz : NF = 3.7 dB TYP. @ f = 2.15 GHz : VCC = 4.5 to 5.5 V : input/output 50 APPLICATIONS * IF amplifiers in LNB for DBS converters etc. ORDERING INFORMATION Part Number Order Number Package Marking C3M Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. PC3225TB-E3 PC3225TB-E3-A 6-pin super minimold (Pb-Free) Note Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, please contact your nearby sales office Part number for sample order: PC3225TB. Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10500EJ01V0DS (1st edition) Date Published December 2004 CP(K) Printed in Japan NEC Compound Semiconductor Devices, Ltd. 2004 PC3225TB PIN CONNECTIONS Pin No. Pin Name OUTPUT GND VCC INPUT GND GND (Top View) (Bottom View) 1 C3M 3 2 1 4 5 6 4 5 6 3 2 1 2 3 4 5 6 PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER (TA = +25C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Part No. fu (GHz) 2.9 2.3 1.0 2.7 3.2 2.8 PO (sat) (dBm) +10.0 +11.5 +13.5 +8.5 +12.0 +15.5 Note GP (dB) 15 23 33 23 23 32.5 Note NF (dB) 6.5 5.0 3.5 6.0 4.5 3.7 Note ICC (mA) 26 25 22 25 19 24.5 Package 6-pin super minimold Marking C1D C1E C1F C2L C3J C3M PC2708TB PC2709TB PC2710TB PC2776TB PC3223TB PC3225TB Note f = 0.95 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10500EJ01V0DS PC3225TB PIN EXPLANATION Pin No. 4 Pin Name INPUT Applied Voltage (V) - Pin Voltage (V) Note Function and Applications 0.98 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 1 OUTPUT Voltage as same as VCC through external inductor - Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. 3 VCC 4.5 to 5.5 - Power supply pin. Which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. 2 5 6 GND 0 - Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference. Note Pin voltage is measured at VCC = 5.0 V Data Sheet PU10500EJ01V0DS 3 PC3225TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Total Circuit Current Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC ICC PD TA Tstg Pin TA = +25C Conditions TA = +25C, Pin 1 and 3 TA = +25C TA = +85C Note Ratings 6 45 270 -40 to +85 -55 to +150 0 Unit V mA mW C C dBm Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol VCC Conditions The same voltage should be applied to pin 1 and 3. Operating Ambient Temperature TA -40 +25 +85 C MIN. 4.5 TYP. 5.0 MAX. 5.5 Unit V ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Circuit Current Power Gain Symbol ICC GP Test Conditions No input signal f = 0.95 GHz, Pin = -35.0 dBm f = 2.15 GHz, Pin = -35.0 dBm Saturated Output Power PO (sat) f = 0.95 GHz, Pin = 5.0 dBm f = 2.15 GHz, Pin = 5.0 dBm Gain 1 dB Compression Output Power PO (1 dB) f = 0.95 GHz f = 2.15 GHz Noise Figure NF f = 0.95 GHz f = 2.15 GHz Upper Limit Operating Frequency fu 3 dB down below flat gain at f = 0.95 GHz Isolation ISL f = 0.95 GHz, Pin = -35.0 dBm f = 2.15 GHz, Pin = -35.0 dBm Input Return Loss RLin f = 0.95 GHz, Pin = -35.0 dBm f = 2.15 GHz, Pin = -35.0 dBm Output Return Loss RLout f = 0.95 GHz, Pin = -35.0 dBm f = 2.15 GHz, Pin = -35.0 dBm Gain Flatness 36.0 36.0 7.0 8.0 7.0 9.5 - 41.0 45.0 8.5 11.0 10.5 13.0 2.5 - - - - - - 4.0 dB dB dB dB MIN. 20.0 30.0 30.5 +13.5 +10.5 +7.0 +5.0 - - - TYP. 24.5 32.5 33.5 +15.5 +12.5 +9.0 +7.0 3.7 3.7 2.8 MAX. 31.0 35.0 36.0 - - - - 4.5 4.5 - GHz dB dBm dBm Unit mA dB GP f = 0.95 to 2.15 GHz 4 Data Sheet PU10500EJ01V0DS PC3225TB OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Output intercept point Symbol OIP3 Test Conditions f = 0.95 GHz f = 2.15 GHz Reference Value 21.0 16.0 Unit dBm Data Sheet PU10500EJ01V0DS 5 PC3225TB TEST CIRCUIT C2 6 GND 5 GND C1 4 330 pF IN 3 VCC C3 1 000 pF VCC 1 OUT 2 GND C4 1 000 pF L1 15 nH 100 pF 50 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Value C1 C2 C3 C4 L1 330 pF 100 pF 1 000 pF 1 000 pF 15 nH Maker Murata Murata Murata Murata Susumu Type code GMR36CH GMR36CH GMR39CH GMR36B TFL0816 INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 24.5 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 3) and output pin (pin 1). Select inductance, as the value listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin. Capacitors of 330 pF for the input pin and 100 pF for the output pin are recommendable as the coupling capacitors. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. 6 Data Sheet PU10500EJ01V0DS PC3225TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 4 5 6 1 3 2 C3 COMPONENT LIST Value C1 C2 C3, C4 L1 330 pF 100 pF 1 000 pF 15 nH Notes 1. 2. 3. 4. 30 x 30 x 0.4 mm double sided copper clad polyimide board. Back side: GND pattern Solder plated on pattern : Through holes C4 L1 C1 C2 Data Sheet PU10500EJ01V0DS 7 PC3225TB TYPICAL CHARACTERISTICS (VCC = 5.0 V, TA = +25C, unless otherwise specified) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 35 30 25 20 15 10 5 0 1 2 3 4 TA = - 40C +25C +85C 5 6 7 Circuit Current ICC (mA) Circuit Current ICC (mA) VCC = 5.0 V 26.0 25.5 25.5 24.5 24.5 23.5 23.0 22.5 - 60 - 40 - 20 0 20 40 60 80 100 CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE VCC = 5.0 V Supply Voltage VCC (V) Operating Ambient Temperature TA (C) POWER GAIN vs. FREQUENCY 36 VCC = 4.5 V 5.0 V 5.5 V Power Gain GP (dB) 36 POWER GAIN vs. FREQUENCY VCC = 5.0 V TA = - 40C +25C +85C 34 Power Gain GP (dB) 34 32 32 30 30 28 28 26 0 1.0 2.0 Frequency f (GHz) 3.0 4.0 26 0 1.0 2.0 Frequency f (GHz) 3.0 4.0 ISOLATION vs. FREQUENCY - 15 - 25 Isolation ISL (dB) Isolation ISL (dB) - 35 - 45 - 55 - 65 0 - 15 - 25 - 35 - 45 - 55 - 65 0 ISOLATION vs. FREQUENCY VCC = 5.0 V TA = - 40C +25C +85C 1.0 2.0 Frequency f (GHz) VCC = 4.5 V 5.0 V 5.5 V 3.0 4.0 1.0 2.0 Frequency f (GHz) 3.0 4.0 Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10500EJ01V0DS PC3225TB INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 4.5 V 5.0 V 5.5 V INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 5.0 V TA = - 40C +25C +85C Input Return Loss RLin (dB) -4 -8 - 12 - 16 - 20 Input Return Loss RLin (dB) -4 -8 - 12 - 16 - 20 0 1.0 2.0 Frequency f (GHz) 3.0 4.0 0 1.0 2.0 Frequency f (GHz) 3.0 4.0 OUTPUT RETURN LOSS vs. FREQUENCY -4 VCC = 4.5 V 5.0 V 5.5 V OUTPUT RETURN LOSS vs. FREQUENCY -4 TA = - 40C +25C +85C Output Return Loss RLout (dB) Output Return Loss RLout (dB) -8 - 12 - 16 - 20 - 24 0 -8 - 12 - 16 - 20 VCC = 5.0 V - 24 0 1.0 1.0 2.0 Frequency f (GHz) 3.0 4.0 2.0 Frequency f (GHz) 3.0 4.0 POWER GAIN vs. INPUT POWER 36 35 34 f = 950 MHz VCC = 4.5 V 5.0 V 5.5 V 38 37 36 POWER GAIN vs. INPUT POWER f = 1 500 MHz VCC = 4.5 V 5.0 V 5.5 V Power Gain GP (dB) 33 32 31 30 29 28 27 26 - 40 - 35 - 30 - 25 - 20 - 15 - 10 -5 Power Gain GP (dB) 35 34 33 32 31 30 29 28 - 40 - 35 - 30 - 25 - 20 - 15 - 10 -5 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10500EJ01V0DS 9 PC3225TB POWER GAIN vs. FREQUENCY 36 35 34 Power Gain GP (dB) OUTPUT POWER vs. INPUT POWER 18 VCC = 5.0 V VCC = 4.5 V 5.0 V 5.5 V Output Power Pout (dBm) 12 33 32 31 30 29 28 27 f = 2 150 MHz 26 - 40 - 35 - 30 6 0 -6 - 25 - 20 - 15 - 10 -5 - 12 - 45 f = 950 MHz 1 500 MHz 2 150 MHz - 35 - 25 - 15 -5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER 18 f = 950 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 OUTPUT POWER vs. INPUT POWER 18 f = 950 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 Output Power Pout (dBm) Output Power Pout (dBm) - 25 - 20 VCC = 4.5 V 5.0 V 5.5 V - 15 - 10 -5 TA = - 40C +25C +85C - 25 - 20 - 15 - 10 -5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER 18 f = 1 500 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 OUTPUT POWER vs. INPUT POWER 18 f = 1 500 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 Output Power Pout (dBm) Output Power Pout (dBm) - 25 - 20 VCC = 4.5 V 5.0 V 5.5 V - 15 - 10 -5 TA = - 40C +25C +85C - 25 - 20 - 15 - 10 -5 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10500EJ01V0DS PC3225TB OUTPUT POWER vs. INPUT POWER 18 f = 2 150 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 OUTPUT POWER vs. INPUT POWER 18 f = 2 150 MHz 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 - 40 - 35 - 30 Output Power Pout (dBm) Output Power Pout (dBm) - 25 - 20 VCC = 4.5 V 5.0 V 5.5 V - 15 - 10 -5 TA = - 40C +25C +85C - 25 - 20 - 15 - 10 -5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 45 - 40 - 35 - 30 - 25 f = 950 MHz 1 500 MHz 2 150 MHz - 20 - 15 - 10 VCC = 5.0 V, f = 1 MHz f = 950/951 MHz : OIP3 = 21.0 dBm f = 1 500/1 501 MHz : OIP3 = 18.2 dBm f = 2 150/2 151 MHz : OIP3 = 16.0 dBm Input Power Pin/tone (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 950/951 MHz 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 950/951 MHz VCC = 4.5 V 5.0 V 5.5 V - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) TA = - 40C +25C +85C - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10500EJ01V0DS 11 PC3225TB OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 1 500/1 501 MHz 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 1 500/1 501 MHz VCC = 4.5 V 5.0 V 5.5 V - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) TA = - 40C +25C +85C - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) OUTPUT POWER (2 TONES) vs. INPUT POWER Output Power (2 tones) Pout/tone (dBm) 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 2 150/2 151 MHz 20 10 0 - 10 - 20 - 30 - 40 - 50 f = 2 150/2 151 MHz VCC = 4.5 V 5.0 V 5.5 V - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) TA = - 40C +25C +85C - 60 - 45 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin/tone (dBm) NOISE FIGURE vs. FREQUENCY 5.0 4.8 Noise Figure NF (dB) 4.6 4.4 4.2 4.0 3.8 3.6 3.4 3.2 3.0 0 500 1 000 1 500 VCC = 4.5 V 5.0 V 5.5 V 2 000 2 500 3 000 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 12 Data Sheet PU10500EJ01V0DS PC3225TB S-PARAMETERS (TA = +25C, VCC = Vout = 5.0 V) S11-FREQUENCY START : 100.000 000 MHz STOP : 3 000.000 000 MHz 1 3 2 1 : 950 MHz 100.41 - 31.537 2 : 1 600 MHz 58.686 - 47.725 3 : 2 150 MHz 39.938 - 24.401 5.3124 pF 2.0843 pF 3.0338 pF S22-FREQUENCY START : 100.000 000 MHz STOP : 3 000.000 000 MHz 1 3 2 1 : 950 MHz 60.637 32.730 2 : 1 600 MHz 70.195 - 20.405 3 : 2 150 MHz 44.370 - 14.407 5.4835 nH 4.8754 pF 5.1383 pF Data Sheet PU10500EJ01V0DS 13 PC3225TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 1.250.1 2.00.2 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 14 Data Sheet PU10500EJ01V0DS 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 PC3225TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10500EJ01V0DS 15 PC3225TB * The information in this document is current as of December, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 16 Data Sheet PU10500EJ01V0DS PC3225TB For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 |
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